SI 5404™ is designed to bond metallic heat sinks, ceramic chips and circuit board substrates. SI 5404™ applications include the bonding of various heat generating devices (power devices) to their respective heat sinks. The adhesive is designed to provide a strong bond between the device and its heat sink as well as low resistance to the flow of heat from the electronic device to the heat sink. A typical application would be the bonding of any power semiconductor, module, graphics processor or other heat generating device to a heat sink or metal enclosure in an electronics circuit.